2017: over 20 billion semiconductor packaging materials

2017 Semiconductor plastic packaging materials market scale will reach $ 21 billion . SEMI and TechSearch International co- published by Global Semiconductor Packaging Materials Outlook displays , including thermal interface materials , including the total global semiconductor packaging materials market in accordance with SEMI and TechSearch International co- published by Global Semiconductor Packaging Materials Outlook displays , including thermal interface materials , including the global Semiconductor Packaging Materials market to 2017 is expected to be worth $ 20 billion to maintain the standard , and in the use of precious metals such as wire bonding status of gold is also changing. Despite continued price pressures remained the largest part of the organic substrate market in 2013 was estimated at $ 7.4 billion worldwide in 2017 will be more than 8.7 billion U.S. dollars . When the end user to seek more cost-effective packaging solutions and face severe price pressure , most packaging materials are also faced with low revenue growth condition . In addition, the wire bonding packaging process transition to the use of copper and silver wire bonding , gold prices have been significantly reduced influence .Masking tape

"Global Semiconductor Packaging Materials Outlook: 2013 /2014 " market research report covers laminate substrates , flexible printed circuit board (flex circuit / tape substrates), lead frame (leadfra-mes), wire bonding (wire bonding), molded compounds (mold compounds), under filler (underfill) materials, liquid packaging materials (liquid encapsulants), sticky crystal material (die attach materials), balls (solder balls), wafer- level packaging medium (wafer level package dielectrics), and thermal interface material (thermal interface materials). Washi tape

Several packaging materials market is strong growth . Mobile computing and communications devices such as smartphones and tablet PCs explosive growth , driven using a laminated substrate (laminate substrate) chip size packaging (chip scale package, CSP) growth. The same products are driving wafer-level packaging (WLP) growth , fueled in turn also for the use of heavy cloth (redistribution) dielectric materials. The growth is also helpful flip chip underfill filling materials market expansion. In some key areas have seen supplier base (supplier base) to strengthen the integration of the new entrants have begun to enter the Asian part of the packaging materials market .Wholesale masking tape